
Cushion Pad for Laminated Hot Press
King Board is a cushion pad used in the lamination hot press process for manufacturing precision equipment parts with a laminated structure such as printed circuit boards (PCBs), MLBs, CCLs, etc., discs, IC cards, LCDs, ceramic laminates, etc. It is a product that replaces the currently commonly used kraft paper. King Board is easier to work with than kraft paper that is used by overlapping multiple sheets, and it allows for cost reduction through repeated reuse.
Maintains constant pressure even during repeated use, stabilizing process quality, and maintains cushioning properties even after hundreds of uses, significantly reducing the defect rate.
It can be used stably without physical deformation even at high temperatures of 200℃, making it suitable for high-functionality lamination and FPC, CCL processes.
Even pressure distribution ensures stable adhesion to substrate steps and micro-curved surfaces, improving lamination quality.
Compared to paper or multi-layer laminated materials, it produces less waste and is easy to manage, resulting in superior productivity and economy.
Single material composition improves process efficiency by increasing compatibility with automated equipment without complex setup.
It can be safely used in sensitive electronic processing environments such as clean rooms as it does not generate static electricity or foreign substances.
Various specifications can be selected according to the purpose and process conditions (temperature, pressure, etc.), making it easy to design a customized process.
| Item | King Board | Craft Paper |
| Reusability | Up to 200 cycles | 1.7–10 cycles |
| Heat Resistance | Up to 250°C | 150–180°C |
| Automation Compatibility | Compatible | Not compatible |
| Contamination | None | Occurs |
| Cost | Higher initial investment | Increasing cumulative cost |
| Item | Unit | B3515AV-GT21 | B3515AV-CT21 | B3515AV-CA21 |
| Thickness | mm | 1.7–10 | 1.7–10 | 1.7–10 |
| Density | g/cm³ | 1.85 | 1.85 | 1.85 |
| Resilience | % | 75–85 | 75–85 | 75–85 |
| Heat Resistance | °C | Up to 250 | Up to 250 | Up to 250 |
| Surface Resistivity | Ω | 10¹¹–10¹² | 10⁴–10⁹ | 10⁴–10⁹ |
| Maximum Size | mm | Min 1150 – Max 1300 | Min 1150 – Max 1300 | Min 1150 – Max 1300 |
| Reusable Cycles | cycles | 100–300+ | 100–300+ | 500+ |
| Features | - | For Hot Press | For Hot Press | For Lamination (High Elasticity) |
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